Browsing by Subject "electronic packaging"
Now showing items 1-2 of 2
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(Texas A&M University, 2005-11-01)The demands for higher clock speeds and larger current magnitude in high-performance flip-chip electronic packaging configurations of small footprint have inevitably raised the concern over rapid thermal transients and ...
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(Texas A&M University, 2004-11-15)The generalized theory of thermoelasticity was employed to characterize the coupled thermal and mechanical wave propagation in high performance microelectronic packages. Application of a Gaussian heat source of spectral ...